学术空间 · Thermoelectric

近三天关于 Thermoelectric、Lattice Thermal Conductivity、Carrier Mobility 的新结果。来源包括 Google Scholar、Nature、ACS、APS、AIP、arXiv。每天更新一次。

本期窗口:2026-11-05 至 2026-11-09(每天滚动更新;建站首批含 11 月 3 日的几篇重要结果,日期已标明)

Thermoelectric

2026-11-05Manipulating diverse degrees of freedom in MnTe: Pathways toward enhanced thermoelectric performance

Applied Physics Reviews · Review

综述 MnTe 基热电材料:从自旋、电荷、轨道、晶格、相变五个维度调控,优化后峰值 ZT 从低于 1 提升到 1.6 以上。

AIP Publishing

2026-11-04Longitudinal and Transverse Thermoelectric Properties in Topological Quantum Materials

arXiv

拓扑热电材料中重原子导致低晶格热导率、线性色散的狄拉克带带来高电迁移率、多能谷带边结构带来高塞贝克系数。

https://arxiv.org/abs/2611.06865

2026-11-04Machine Learning Prediction of Bulk Bi2Te3 Thermoelectric Properties

ACS Applied Energy Materials · Subash Chandra Bose Rapaka

用 740 个样本(151 篇文献)测试机器学习预测体相 Bi2Te3 的塞贝克系数、电导率、功率因子、热导率和 zT:随机划分时 zT 的 R²=0.72,未见实验室降至 0.43;补 3 个实测样本后可回升至 0.64。

ACS Publications

2026-11-03Thermoelectric properties of quasi-skutterudite single crystals M5Rh6Sn18 (M = Sc, Y, Lu)

APL Materials

准方钴矿单晶的热电性质:300 K 时晶格热导率 ≤2 W/mK,Lu 样品功率因子约 0.9 μW cm−1 K−2、ZT 约 0.005,整体热电性能一般。

AIP Publishing

2026-11-03Large transverse thermoelectric effect in graphene nanostructures

Nature Communications · Han, Guo, Wang et al.

室温、零磁场下亚微米石墨烯器件的横向热电效应(BTTE),横向塞贝克系数 27.9 μV/K,横向热电功率因子约 35.8 μW cm−1 K−2,可用于纳米尺度热流传感与能量收集。

https://doi.org/10.1038/s41467-026-78890-2

Lattice Thermal Conductivity

2026-11-05Anomalously Low Thermal Conductivity in Undercoordinated Amorphous Silicon

Physical Review Letters

高压相工程制备的非晶硅在300 K时热导率低至0.67 W/m·K,比Cahill-Watson-Pohl基准低约33%,归因于高压快速淬火产生的欠配位Si位点。

https://journals.aps.org/prl/abstract/10.1103/m9hp-5h28

2026-11-04Balanced electron and phonon heat transport in metallic ε-TaN

Physical Review B

金属 ε-TaN 同时有可观的电子热导率和晶格热导率:单晶室温总热导率 273±5 W/mK,其中晶格贡献占 79%,多晶(0.5 μm 晶粒)为 145±5 W/mK。

https://journals.aps.org/prb/abstract/10.1103/znlw-hym7

2026-11-03Lattice Softening and Defect-Induced Phonon Scattering Drive Near-Minimum Lattice Thermal Conductivity in Sb- and S-Alloyed BiSe

ACS Applied Energy Materials

Sb 合金化使 BiSe 室温晶格热导率从约 0.90 降至 0.38 W/mK(降 57.8%),再掺 S 降至约 0.33 W/mK,总计降约 63.3%,接近最小值。

ACS Publications

2026-11-03Revealing Anisotropic Dielectric and Thermal Behavior in Layered Ca3Co4O9 Thin Films

ACS Applied Energy Materials

层状 Ca3Co4O9 的各向异性热学行为:体材料热导率 0.62 W/mK,LaAlO3 / MgO 上薄膜的有效厚度方向热导率分别为 0.91 / 1.46 W/mK。

ACS Publications

Carrier Mobility

2026-11-04Multifunctional Phase Engineering Expands the Carrier Concentration Optimization Window for High-Performance Mg3(Bi, Sb)2 Thermoelectrics

Advanced Functional Materials

NbC促进晶粒长大、抑制晶界散射从而提高载流子迁移率,复合材料在300–573 K平均功率因子达3.1 mW·m⁻¹·K⁻²,523 K时zT最高约1.3,单腿器件在温差282 K下转换效率约5.5%。

https://advanced.onlinelibrary.wiley.com/doi/10.1002/adfm.79401

2026-11-04Vacuum annealing effects on the transport and thermoelectric properties of the novel layered Bi-chalcogenide LaOBiSnS3

Materials Research Express

真空退火主要通过大幅提高载流子迁移率降低电阻率,ZT在773 K达约0.20,比未退火样品的约0.07提高约2.9倍。

https://iopscience.iop.org/article/10.1088/2053-1591/aebaf0/pdf

2026-11-03Site-Selective Doping Chemistry on Quaternary Diamondoid Thermoelectrics Cu2ZnSnSe4

ACS Applied Energy Materials

Cd / Zn 掺杂同时提高空穴浓度和迁移率(抑制阳离子无序、趋向理想晶格对称),室温电导率分别达 1200 / 900 S/cm;再经 Ag 合金化降低晶格热导率,峰值 ZT 0.54(800 K)。

ACS Publications